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Fluid and Particle Process Engineering

 

In chemical processes for producing inorganic materials, organic materials, and polymer materials, particulate solid material so called “Powder” are used as intermediates and final products. Our research works are investigation and establishment for the designing and controlling methods of a series of processes from production to handling of particulate solid materials. Main topics are development of dry surface cleaning method, compression molding, powder property evaluation method, kneading, layer formation during drying, particle generation by spray drying as a process involving heat and mass transfer, gas-solid chemical heat storage. We are also conducting mesoscale numerical calculations of particle dispersion systems as basic research on interfacial phenomena and interactions between particles.

  • Prof. GOTOH Kuniaki
  • E-mail: gotoh [at] okayama-u.ac.jp
  • Chemical engineering, Powder technology, Thermal engineering, Heat and mass transfer, Numerical simulation

 

Directory of Researchers  

 

Various particle adhesions formed in dry powder unit operations

Unit operations of dry powder and evaluation methods of powder handling characteristics are investigated with particular attention to the inter-particle and particle-solid wall adhesion. Recent investigation topics are removal method of particles adhering to the wall surface, compression molding and the evaluation method of powder adhesion characteristics which is the controlling factor for supply stability.

 

  • Assoc. Prof. NAKASO Koichi
  • E-mail: knakaso [at] okayama-u.ac.jp
  • Chemical engineering, Powder technology, Thermal engineering, Heat and mass transfer, Numerical simulation

 

Directory of Researchers  

 

Experiment of atomization process

Evaluation of the processes with heat transfer such as a spray drying process are investigated. In the present research, atomization of liquid source material and drying process of droplet are investigated in terms of heat transfer phenomenon. Moreover, heat transfer enhancement in heat utilization device such as thermal energy storage unit and chemical heat pump is investigated.